The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2025
Filed:
Nov. 27, 2020
Applicant:
Lg Innotek Co., Ltd., Seoul, KR;
Inventors:
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); G06V 40/13 (2022.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 25/16 (2013.01); G06V 40/1306 (2022.01); H01L 23/5386 (2013.01); H01L 23/5387 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/32237 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/19041 (2013.01);
Abstract
A fingerprint recognition module according to an embodiment includes a substrate; a conductive pattern portion disposed on the substrate; a protective layer partially disposed on the substrate and the conductive pattern portion; a first connection portion disposed on a conductive pattern portion exposed through a first open region of the protective layer; and a first chip disposed on the first connection portion; wherein the first connection portion includes an anisotropic conductive adhesive disposed on the conductive pattern portion exposed through the first open region and having a closed loop shape and including conductive particles.