The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2025

Filed:

Mar. 22, 2022
Applicant:

Toyota Motor Engineering & Manufacturing North America, Inc., Plano, TX (US);

Inventors:

Feng Zhou, Ann Arbor, MI (US);

Yanghe Liu, Ann Arbor, MI (US);

Hiroshi Ukegawa, South Lyon, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 25/00 (2006.01); H01L 25/07 (2006.01); H01L 25/16 (2023.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H01L 24/24 (2013.01); H01L 24/25 (2013.01); H01L 24/82 (2013.01); H01L 25/072 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H05K 7/2089 (2013.01); H01L 23/3735 (2013.01); H01L 2224/24011 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/244 (2013.01); H01L 2224/245 (2013.01); H01L 2224/2512 (2013.01); H01L 2224/82101 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/1517 (2013.01);
Abstract

In one embodiment, an electronics assembly includes a cold plate assembly having a first surface, at least one power electronic device disposed within a recess on the first surface of the cold plate assembly, and a printed circuit board disposed on a surface of the at least one power electronic device. The printed circuit board includes a first insulation layer, a second insulation layer, an electrically conductive power layer between the first insulation layer and the second insulation layer, a first set of thermal vias extending from the electrically conductive power layer and toward the first surface of the cold plate assembly, and a second set of thermal vias extending from the first surface of the cold plate assembly toward the electrically conductive power layer. The first set of thermal vias is electrically isolated from the second set of thermal vias.


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