The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2025
Filed:
Oct. 01, 2020
Mitsubishi Electric Corporation, Tokyo, JP;
Ko Kanaya, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A semiconductor device () according to the present disclosure comprises a semiconductor chip () in which are formed a protruding terminal () that electrically connects to a transistor () and that has a greater cross-sectional area than a bonding wire () and a short circuit prevention side wall () that is insulating and that covers side surfaces that face the surroundings of the protruding terminal (). The semiconductor chip () is bonded to the upper surface () of a metal plate () by a conductive bonding material. A conductor pattern (a) that is formed in a circuit board () bonded to the upper surface () of the metal plate () is connected via the bonding wire () to the projection-direction end of the protruding terminal ().