The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2025
Filed:
Jan. 06, 2023
Applicant:
Regents of the University of Minnesota, Minneapolis, MN (US);
Inventors:
Bethanie J Stadler, Shoreview, MN (US);
Rhonda R. Franklin, Falcon Heights, MN (US);
Assignee:
Regents of the University of Minnesota, Minneapolis, MN (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01R 12/52 (2011.01); H05K 1/14 (2006.01); H05K 3/00 (2006.01); H05K 3/34 (2006.01); H05K 3/36 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 21/486 (2013.01); H01L 23/5384 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01R 12/52 (2013.01); H05K 1/145 (2013.01); H05K 1/181 (2013.01); H05K 3/0014 (2013.01); H05K 3/3436 (2013.01); H05K 3/3494 (2013.01); H05K 3/368 (2013.01); H05K 3/424 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13118 (2013.01); H01L 2224/1312 (2013.01); H01L 2224/13138 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81222 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/01014 (2013.01); H05K 2201/10378 (2013.01); H05K 2203/0723 (2013.01);
Abstract
A device includes a porous substrate that include a plurality of pores and a plurality of nanodevices dispersed in at least a portion of the plurality of pores. Each of the plurality of nanodevices includes a magnetic nanowire and a solder nanoparticle. The magnetic nanowires are configured to generate heat in response to an alternating magnetic field. The solder nanoparticles are configured to receive a portion of the heat and reflow to connect to one or more devices or surfaces.