The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2025
Filed:
May. 25, 2020
Jcet Group Co., Ltd., Wuxi, CN;
Yaojian Lin, Wuxi, CN;
JCET GROUP CO., LTD., Wuxi, CN;
Abstract
The present invention discloses a package structure and a method for forming the same. The package structure includes a substrate, a chip, a first plastic package layer and a support block, wherein the substrate includes a first surface and a second surface; the chip is disposed on the first surface; the first plastic package layer is disposed on the first surface and packages the chip; the support block is disposed on the second surface; and in a thickness direction of the substrate, an overlapping region exists between the chip and the support block, and a thermal expansion coefficient of the chip is equal to a thermal expansion coefficient of the support block. The support block can counteract part of stress to avoid problems such as warping or twisting. Due to the overlapping region, a counteraction function of the support block on the stress exerted on the chip can be improved.