The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2025

Filed:

Feb. 22, 2022
Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventor:

Yushi Sato, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/36 (2006.01); H01L 23/433 (2006.01); H01L 23/495 (2006.01); H01L 29/739 (2006.01);
U.S. Cl.
CPC ...
H01L 23/315 (2013.01); H01L 23/3121 (2013.01); H01L 23/36 (2013.01); H01L 23/4334 (2013.01); H01L 23/49558 (2013.01); H01L 29/7395 (2013.01);
Abstract

A semiconductor module includes: a first power semiconductor element that includes a first main current electrode; a main body that accommodates therein the first power semiconductor element; and a first main current terminal connectable to the first main current electrode. The main body includes: a top face; a side face that connects to the top face; a bottom face fixable to a cooler; and a recessed portion that is on the side face, and accommodates therein an end portion of an insulating member. The first main current terminal protrudes from the side face of the main body, and includes: a first face; and a second face on an opposite side of the first face. The second face is closer to the bottom face than the first face on the side face. The recessed portion is on the side face between the bottom face and the second face, and is at a position apart from the bottom face.


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