The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2025

Filed:

Jan. 27, 2023
Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventors:

Atapol Prajuckamol, Thanyaburi, TH;

Chee Hiong Chew, Seremban, MY;

Yushuang Yao, Shenzhen, CN;

Vemmond Jeng Hung Ng, Senawang, MY;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/10 (2006.01); B32B 3/02 (2006.01); B32B 9/00 (2006.01); B32B 9/04 (2006.01); B32B 15/20 (2006.01); H01L 21/48 (2006.01); H01L 23/13 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/13 (2013.01); B32B 3/02 (2013.01); B32B 9/005 (2013.01); B32B 9/041 (2013.01); B32B 15/20 (2013.01); H01L 21/4871 (2013.01); H01L 23/3735 (2013.01); B32B 2250/03 (2013.01); B32B 2250/40 (2013.01); B32B 2307/206 (2013.01); B32B 2457/00 (2013.01);
Abstract

Implementations of a substrate may include an electrically insulative layer having a first largest planar side and a second largest planar side opposing the first largest planar side; a first electrically conductive layer coupled to the first largest planar side and including a first scalloped edge having a first pattern; and a second electrically conductive layer coupled to the second largest planar side and including a second scalloped edge having a second pattern. The first pattern and the second pattern may alternate along at least one edge of the first largest planar side and at least one edge of the second largest planar side, respectively.


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