The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2025

Filed:

Mar. 15, 2022
Applicants:

Hyundai Motor Company, Seoul, KR;

Kia Corporation, Seoul, KR;

Inventors:

Hyong Joon Park, Hwaseong-si, KR;

Ju Man Yoon, Seoul, KR;

Seul Bee Lee, Seoul, KR;

Ju Hee Kim, Chungcheongnam-do, KR;

Ok Geun Ha, Hwaseong-si, KR;

Se Heun Kwon, Incheon, KR;

Sung Jun Yoon, Suwon-si, KR;

Sang Hoon Lee, Taebaek-si, KR;

Assignees:

HYUNDAI MOTOR COMPANY, Seoul, KR;

KIA CORPORATION, Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01G 2/08 (2006.01); H01G 2/10 (2006.01); H02M 7/00 (2006.01);
U.S. Cl.
CPC ...
H01G 2/08 (2013.01); H01G 2/10 (2013.01); H02M 7/003 (2013.01); H05K 7/20254 (2013.01); H05K 7/20872 (2013.01); H05K 7/20927 (2013.01);
Abstract

The present disclosure provides a capacitor module including: a capacitor; a first housing having a hexahedron shape and having an inner space in which the capacitor is disposed, the first housing including a pair of cooling parts recessed inwards from a pair of parallel surfaces among outer side surfaces thereof such that a refrigerant flows, a pair of cooling channels disposed inside opposite side surfaces perpendicular to the surfaces of the pair of cooling parts such that the pair of cooling parts communicate with each other, and a through-hole configured to connect each of the cooling channels to the outside such that the refrigerant is introduced or discharged therethrough; and a cooling plate coupled to the first housing so as to seal the cooling parts.


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