The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2025

Filed:

Apr. 24, 2023
Applicant:

Cyntec Co., Ltd., Hsinchu, TW;

Inventors:

Wenyu Lin, Taipei, TW;

TsungHao Lu, Hsinchu, TW;

Hao Chun Chang, Hsinchu, TW;

Assignee:

CYNTEC CO., LTD., Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/32 (2006.01); H01F 27/02 (2006.01); H01F 27/22 (2006.01); H01F 27/24 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01F 41/04 (2006.01); H05K 1/18 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01F 27/327 (2013.01); H01F 27/022 (2013.01); H01F 27/22 (2013.01); H01F 27/24 (2013.01); H01F 27/2823 (2013.01); H01F 27/2852 (2013.01); H01F 27/29 (2013.01); H01F 41/04 (2013.01); H05K 1/18 (2013.01); H01L 25/072 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10515 (2013.01);
Abstract

A stacked electronic structure, including a substrate, wherein electronic devices are disposed on the substrate, and a molding body encapsulates the electronic devices, wherein a first thermal conductive layer is disposed on a first electronic device, and a second thermal conductive layer is disposed on a second electronic device, wherein a magnetic device comprising a magnetic body is disposed over a top surface of the molding body, wherein at least one third thermal conductive layer is disposed on the magnetic body, and the first thermal conductive layer and the second thermal conductive layer are respectively connected with the at least one third thermal conductive layer for dissipating heat.


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