The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2025
Filed:
Jan. 10, 2022
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Shinichi Kondo, Tokyo, JP;
Takashi Inagaki, Tokyo, JP;
Ryuichi Wada, Tokyo, JP;
Yusuke Nagai, Tokyo, JP;
Takashi Suzuki, Tokyo, JP;
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 1/147 (2006.01); C08G 59/38 (2006.01); C08K 9/02 (2006.01); C22C 38/02 (2006.01); H01F 27/255 (2006.01); H01F 41/02 (2006.01); H01F 41/04 (2006.01);
U.S. Cl.
CPC ...
H01F 1/14766 (2013.01); C08G 59/38 (2013.01); C08K 9/02 (2013.01); C22C 38/02 (2013.01); H01F 27/255 (2013.01); H01F 41/0246 (2013.01); H01F 41/04 (2013.01); C08K 2201/01 (2013.01); C22C 2202/02 (2013.01);
Abstract
A multilayer coil device includes an element formed by laminating a coil conductor and a magnetic element body. The magnetic element body includes soft magnetic particles and an epoxy resin. The soft magnetic particles include soft magnetic metal particles. The epoxy resin has an epoxy value of 150 or less. The epoxy resin is filled in gap spaces between the soft magnetic particles.