The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2025

Filed:

Nov. 18, 2022
Applicant:

Huawei Digital Power Technologies Co., Ltd., Shenzhen, CN;

Inventors:

Hui Wang, Xi'an, CN;

Peng Cheng, Xi'an, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 27/00 (2006.01); F25B 25/00 (2006.01); F25B 41/00 (2021.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
F25B 41/00 (2013.01); F25B 25/00 (2013.01); H05K 7/208 (2013.01); F25B 2400/0401 (2013.01); F25B 2500/03 (2013.01); F25B 2600/2501 (2013.01); F25B 2700/04 (2013.01);
Abstract

A refrigerant pump and a data center cooling system. The data center cooling system includes a refrigerant connected between a condenser and an evaporator. The refrigerant includes a housing, a partition plate, and a pump head. The housing is provided with a liquid inlet and a liquid outlet. The partition plate is disposed inside the housing, and they jointly form first space and second space. A pump body includes the pump head and a motor. An inlet of the pump head is located at the bottom of the first space in a gravity direction. The motor is located in the second space. The pump head is configured to transfer refrigerant in the first space to the second space. The liquid inlet is directly connected to the condenser by using a pipeline. The first space is configured to store refrigerant of the data center cooling system.


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