The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2025
Filed:
Feb. 08, 2021
Applicant:
Resonac Corporation, Tokyo, JP;
Inventor:
Shinichirou Sukata, Tokyo, JP;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 11/04 (2006.01); C09J 11/06 (2006.01); C09J 163/00 (2006.01); H01B 1/22 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
C09J 11/04 (2013.01); C09J 11/06 (2013.01); C09J 163/00 (2013.01); H01B 1/22 (2013.01); H01L 21/50 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81193 (2013.01);
Abstract
A conductive adhesive composition, the composition containing: (A) conductive particles; (B) a thermosetting resin; and (C) a flux activator. The conductive particles contain a metal having a melting point of 200° C. or lower. In a volume-based cumulative particle size distribution of the conductive particles, a cumulative 50% particle diameter D50 is 3 to 10 μm, and a cumulative 10% particle diameter D10 is 2.4 μm or more. The flux activator contains a compound having a hydroxyl group and a carboxyl group.