The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2025

Filed:

Aug. 19, 2021
Applicant:

Mitsubishi Chemical Corporation, Tokyo, JP;

Inventors:

Tomohiro Kyotani, Tokyo, JP;

Eiji Dejima, Tokyo, JP;

Naoko Sumitani, Tokyo, JP;

Tomohiro Kato, Tokyo, JP;

Takeshi Sawai, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); H01L 21/304 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); H01L 21/304 (2013.01);
Abstract

An object of the present invention is to provide a silica particle having excellent polishing characteristics and storage stability. The present invention relates to a silica particle in which a proportion of silanol groups present on a surface represented by (x/y)×100% is 15% or less, where a content of silanol groups on the surface is x mass % and a content of bulk silanol groups is y mass %.


Find Patent Forward Citations

Kyotani, Tomohiro. (2025). Silica particle and production method therefor, silica sol, polishing composition, polishing method, method for producing semiconductor wafer and method for producing semiconductor device (U.S. Patent No. 12297376). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12297376

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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