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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12297354 B1

PDFFull Text
Date of Patent:
May. 13, 2025

Filed:

Jan. 18, 2019

Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor

Applicant:

Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;

Inventors:

Yoshihiro Yoneda, Ageo, JP;

Toshihiro Hosoi, Ageo, JP;

Kenshiro Fukuda, Ageo, JP;

Toshifumi Matsushima, Ageo, JP;

Assignee:

MITSUI MINING & SMELTING CO., LTD., Tokyo, JP;

Attorney:

GREENBLUM & BERNSTEIN, P.L.C.

Primary Examiner:

Kregg T Brooks

Int. Cl.
CPC ...
C08L 79/08 (2006.01); C08K 3/22 (2006.01); C08K 5/18 (2006.01); C08L 63/00 (2006.01); H01B 3/40 (2006.01); H05K 1/05 (2006.01);
U.S. Cl.
CPC ...
C08L 79/08 (2013.01); C08K 3/22 (2013.01); C08K 5/18 (2013.01); C08L 63/00 (2013.01); H01B 3/40 (2013.01); H05K 1/056 (2013.01); C08K 2003/2237 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0179 (2013.01); H05K 2201/0187 (2013.01); H05K 2201/0218 (2013.01);
Abstract

A resin composition for use in a dielectric layer of a capacitor is provided that can control a decrease in capacitance or dielectric constant at high temperature and ensure high dielectric characteristics and high adhesion of the composition to a circuit. The resin composition contains a resin component containing an epoxy resin, a diamine compound, and a polyimide resin; and a dielectric filler composed of a metal oxide containing at least two elements selected from the group consisting of Ba, Ti, Sr, Pb, Zr, La, Ta, and Bi. The content of the dielectric filler is 60 to 85 parts by weight on the basis of 100 parts by weight of solid content in the resin composition.

Find Patent Forward Citations

Yoneda, Yoshihiro. (2025). Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor (U.S. Patent No. 12297354). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12297354

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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