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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12297318 B1

PDFFull Text
Date of Patent:
May. 13, 2025

Filed:

Jul. 13, 2023

Curable resin composition

Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Kyohei Wada, Kawasaki, JP;

Chiaki Nishiura, Tokyo, JP;

Ryo Ogawa, Kawasaki, JP;

Assignee:

Canon Kabushiki Kaisha, Tokyo, JP;

Attorney:

Venable LLP

Primary Examiner:

Megan McCulley

Int. Cl.
CPC ...
C08G 59/38 (2006.01); B29C 64/30 (2017.01); B33Y 70/00 (2020.01); C08G 59/32 (2006.01); C08G 59/36 (2006.01); C08G 59/40 (2006.01); C08G 65/18 (2006.01); C08G 65/22 (2006.01); B29C 64/106 (2017.01); B29K 63/00 (2006.01); B33Y 10/00 (2015.01);
U.S. Cl.
CPC ...
C08G 59/38 (2013.01); B29C 64/30 (2017.08); B33Y 70/00 (2014.12); C08G 59/3245 (2013.01); C08G 59/36 (2013.01); C08G 59/4064 (2013.01); C08G 65/18 (2013.01); C08G 65/22 (2013.01); B29C 64/106 (2017.08); B29K 2063/00 (2013.01); B33Y 10/00 (2014.12);
Abstract

A curable resin composition includes (A) a specific curable resin and (C) a curing agent, and further includes (BI) 0.1 parts by mass or more and 20 parts by mass or less of a polyhydric alcohol having 2 to 5 hydroxyl groups, based on based on 100 parts by mass of the curable resin (A); (BII) a cyclic compound having 3 to 6 reactive groups and a reactive group equivalent of 100 g/eq or more and 300 g/eq or less; or (BIII) a specific oxetane compound in a mass ratio of the curable resin (A) to the oxetane compound (BIII) being 5:5 to 9:1.

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Quick Actions:

Wada, Kyohei. (2025). Curable resin composition (U.S. Patent No. 12297318). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12297318

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