The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2025
Filed:
Jan. 14, 2021
Applicant:
The Board of Trustees of the University of Illinois, Urbana, IL (US);
Inventors:
Jeffrey S. Moore, Savoy, IL (US);
Scott R. White, Champaign, IL (US);
Ian D. Robertson, Philadelphia, PA (US);
Nancy R. Sottos, Champaign, IL (US);
Jia E. Aw, Champaign, IL (US);
Assignee:
The Board of Trustees of the University of Illinois, Urbana, IL (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08F 232/08 (2006.01); B29C 48/05 (2019.01); B29C 48/87 (2019.01); B29C 48/88 (2019.01); B29C 48/91 (2019.01); B29C 64/106 (2017.01); B29C 64/118 (2017.01); B29C 64/209 (2017.01); B29C 70/38 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 70/10 (2020.01); C08K 5/524 (2006.01); C08K 7/06 (2006.01); B29K 23/00 (2006.01); B29K 101/10 (2006.01); B29K 105/00 (2006.01); B29K 307/04 (2006.01); C08K 3/04 (2006.01);
U.S. Cl.
CPC ...
C08F 232/08 (2013.01); B29C 48/05 (2019.02); B29C 48/87 (2019.02); B29C 48/911 (2019.02); B29C 64/106 (2017.08); B29C 64/118 (2017.08); B29C 64/209 (2017.08); B29C 70/384 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 70/10 (2020.01); C08K 5/524 (2013.01); C08K 7/06 (2013.01); B29K 2023/38 (2013.01); B29K 2101/10 (2013.01); B29K 2105/0014 (2013.01); B29K 2105/0061 (2013.01); B29K 2307/04 (2013.01); C08K 3/04 (2013.01);
Abstract
The present disclosure provides a novel method of 3D printing using frontal polymerization chemistry. This method enables the printing of tough, high quality thermosets in a short time with the option of adding fiber reinforcement. As such, it facilitates fabrication of mechanically robust 3D-printed devices and structures.