The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2025

Filed:

Mar. 10, 2022
Applicant:

Denso Corporation, Kariya, JP;

Inventors:

Masakazu Morimoto, Kariya, JP;

Yasuhiro Mizuno, Kariya, JP;

Masaki Uchiyama, Kariya, JP;

Yuki Sugiyama, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B60H 1/00 (2006.01); F25B 41/40 (2021.01); F25B 41/42 (2021.01);
U.S. Cl.
CPC ...
B60H 1/00342 (2013.01); B60H 1/00571 (2013.01); F25B 41/40 (2021.01); F25B 41/42 (2021.01);
Abstract

A plurality of components of a refrigeration cycle are connected to a connection module. The connection module includes a body having a refrigerant flow path that constitutes a part of a refrigerant flow path in the refrigeration cycle. The refrigerant flow path includes a high-temperature-side flow path and a low-temperature-side flow path. The high-temperature-side flow path has a connection port to which a high-temperature-side component of the plurality of components, through which a high-pressure refrigerant of the refrigeration cycle flows, is connectable. The low-temperature-side flow path has a connection port to which a low-temperature-side component of the plurality of components, through which a refrigerant having a lower temperature than the high-pressure refrigerant flows, is connectable.


Find Patent Forward Citations

Loading…