The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2025

Filed:

Nov. 08, 2021
Applicant:

Henkel Ag & Co. Kgaa, Duesseldorf, DE;

Inventors:

Sascha Poeller, Duisburg, DE;

Manuel Schiel, Duesseldorf, DE;

Tanja Rossberg, Haan, DE;

Andreas Ferencz, Duesseldorf, DE;

Tim Welters, Hilden, DE;

Uwe Franken, Dormagen, DE;

Assignee:

Henkel AG & Co. KGaA, Duesseldorf, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/106 (2017.01); B29C 64/188 (2017.01); B29C 64/209 (2017.01); B29C 64/245 (2017.01); B29C 64/264 (2017.01); B33Y 10/00 (2015.01); B33Y 40/20 (2020.01); B33Y 70/00 (2020.01); B29K 75/00 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
B29C 64/106 (2017.08); B29C 64/188 (2017.08); B29C 64/209 (2017.08); B29C 64/245 (2017.08); B29C 64/264 (2017.08); B33Y 10/00 (2014.12); B33Y 40/20 (2020.01); B33Y 70/00 (2014.12); B29K 2075/00 (2013.01); B29K 2105/0002 (2013.01); B29K 2105/0014 (2013.01); B29K 2105/007 (2013.01); B29K 2105/0094 (2013.01);
Abstract

The present invention lies in the field of 3D printing methods. In particular, the invention relates to 3D printing methods for the production of a 3D part in a layer-by-layer manner, wherein the printable composition is a pasty polyurethane composition comprising at least one polyisocyanate resin, at least one monomer and/or prepolymer that is polymerizable by exposure to radiation and at least one photoinitiator, wherein the pasty polyurethane composition has a viscosity factor (1.5/15) of at least 2 at application temperature.


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