The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2025
Filed:
Nov. 10, 2023
Applicant:
Fuji Electric Co., Ltd., Kawasaki, JP;
Inventors:
Assignee:
FUJI ELECTRIC CO., LTD., Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/02 (2006.01); B23K 1/00 (2006.01); B23K 1/20 (2006.01); B23K 35/26 (2006.01); C22C 13/02 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H05K 3/34 (2006.01); B23K 35/362 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
B23K 35/0222 (2013.01); B23K 1/0016 (2013.01); B23K 1/203 (2013.01); B23K 35/0244 (2013.01); B23K 35/025 (2013.01); B23K 35/26 (2013.01); B23K 35/262 (2013.01); C22C 13/02 (2013.01); H01L 21/4853 (2013.01); H01L 24/00 (2013.01); H01L 24/29 (2013.01); H01L 24/48 (2013.01); B23K 35/362 (2013.01); B23K 2101/42 (2018.08); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/73 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29211 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83455 (2013.01); H01L 2924/014 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/3511 (2013.01); H05K 3/3463 (2013.01);
Abstract
A solder material having a good thermal-cycle fatigue property and wettability. The solder material contains not less than 6.0% by mass and not more than 8.0% by mass Sb, not less than 3.0% by mass and not more than 5.0% by mass Ag, and the balance of Sn and incidental impurities. Also, a semiconductor device may include a joining layer between a semiconductor element and a substrate electrode or a lead frame, the joining layer being obtained by melting this solder material.