The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 06, 2025

Filed:

Jan. 22, 2021
Applicant:

Max-planck-gesellschaft Zur Förderung Der Wissenschaften E.v., Munich, DE;

Inventors:

Razmik Mirzoyan, Unterschleißheim, DE;

Masahiro Teshima, Unterschleißheim, DE;

David Gascon Fora, Barcelona, ES;

Andreu Sanuy Charles, Barcelona, ES;

Sergio Gomez Fernandez, Barcelona, ES;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2005.12); H04N 25/78 (2022.12); H04N 25/79 (2022.12); H10F 39/00 (2024.12);
U.S. Cl.
CPC ...
H10F 39/809 (2024.12); H04N 25/78 (2022.12); H04N 25/79 (2022.12); H10F 39/018 (2024.12);
Abstract

A semiconductor photomultiplier module () comprises a first semiconductor chip () disposed in a first plane and comprising an array () of single-photon avalanche diodes (SPAD), a second semiconductor chip () disposed in a second plane and comprising a first part of an electronic read-out circuit, and a third semiconductor chip () comprising a second part of the electronic read-out circuit, wherein the first semiconductor chip () and the second semiconductor chip () are arranged in a stacked relationship and vertical electrical interconnects () are arranged to electrically interconnect the first semiconductor chip () with the second semiconductor chip ().


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