The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 06, 2025

Filed:

Jan. 11, 2023
Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventor:

Tetsuya Oda, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2005.12); H05K 3/28 (2005.12); H05K 9/00 (2005.12); H05K 3/30 (2005.12);
U.S. Cl.
CPC ...
H05K 9/00 (2012.12); H05K 1/181 (2012.12); H05K 3/284 (2012.12); H05K 3/303 (2012.12); H05K 2201/0707 (2012.12); H05K 2201/10371 (2012.12);
Abstract

A module includes a substrate including a first surface, a first component mounted on the first surface, at least a part of which is covered with a first conductive film, a sealing resin arranged to cover the first surface and the first component, and a shield film that covers a part of a surface of the sealing resin on a side distant from the substrate. The surface of the sealing resin on the side distant from the substrate includes a shielded region covered with the shield film when viewed in a direction perpendicular to the first surface and a non-shielded region not covered with the shield film. The non-shielded region is superimposed on at least a part of the first conductive film.


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