The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 06, 2025

Filed:

Sep. 13, 2023
Applicants:

Yazaki Corporation, Tokyo, JP;

Toyota Jidosha Kabushiki Kaisha, Aichi-ken, JP;

Inventors:

Yusuke Tsutagawa, Makinohara, JP;

Yasuhiro Tanaka, Makinohara, JP;

Hiroaki Kodera, Susono, JP;

Norihiro Ushida, Numazu, JP;

Hiroyuki Hattori, Okazaki, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02G 5/00 (2005.12); H02G 5/02 (2005.12);
U.S. Cl.
CPC ...
H02G 5/02 (2012.12);
Abstract

A resin molded component includes a bus bar having conductivity, a conductive member including an insertion hole into which the bus bar is inserted along an axis line direction, a resin member covering the bus bar and insulating the bus bar and the conductive member, and a potting material charged into the insertion hole. The bus bar includes a bend terminal portion positioned at an end portion in the axis line direction, and bent along a terminal bend direction, and a bus bar crank portion positioned inside the insertion hole and extending along a crank direction intersecting with the axis line direction and the terminal bend direction. The resin member includes a resin crank portion positioned inside the insertion hole and covering and insulating the bus bar crank portion. The potting material covers a whole circumference of the resin crank portion when charged into the insertion hole.


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