The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 06, 2025

Filed:

May. 13, 2022
Applicants:

Beijing Boe Sensor Technology Co., Ltd., Beijing, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Sihui Bao, Beijing, CN;

Chunnan Feng, Beijing, CN;

Yunnan Jin, Beijing, CN;

Zhifeng Zhang, Beijing, CN;

Guohui Nan, Beijing, CN;

Liang Guo, Beijing, CN;

Haoyang Zhang, Beijing, CN;

Zhe Chen, Beijing, CN;

Shuo Yang, Beijing, CN;

Zheng Chen, Beijing, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 21/00 (2005.12); H01Q 1/22 (2005.12); H01Q 9/04 (2005.12);
U.S. Cl.
CPC ...
H01Q 9/0414 (2012.12); H01Q 1/22 (2012.12);
Abstract

An antenna is provided, and belongs to the field of communication technology and includes a first dielectric substrate, a first conductive layer, a second dielectric substrate, a second conductive layer, a third dielectric substrate and a conductive third layer which are sequentially stacked. The first conductive layer includes at least one first and second feed lines; the second conductive layer is provided with at least one first and second openings; the third conductive layer includes at least one first radiation part. Orthographic projections of any two of a first opening, a first feed line, a first radiation part corresponding to each on the other first dielectric substrate overlap with other; each an orthographic projection of a first radiation part on the first dielectric substrate intersects with that of each of a corresponding first and second feed lines on the first dielectric substrate.


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