The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 06, 2025

Filed:

Apr. 24, 2024
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventor:

Kengo Matsumoto, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2005.12); G06K 19/077 (2005.12); H01Q 1/36 (2005.12); H01Q 7/00 (2005.12);
U.S. Cl.
CPC ...
H01Q 1/2208 (2012.12); G06K 19/07722 (2012.12); G06K 19/0775 (2012.12); H01Q 1/36 (2012.12); H01Q 7/00 (2012.12);
Abstract

An RFID module is provided that includes a substrate having first and second main surfaces; an RFIC chip and a coil conductor on the first main surface; and a first conductor pattern within the substrate. The coil conductor includes a plurality of coil elements each having a pair of legs and a bridge connecting first ends of the pair of legs. The coil elements are arranged in a row across a predetermined winding axis; and a second conductor pattern is on the first main surface and connects with the coil elements to form a coil shape. A first end of the RFIC chip is connected to a first end of the coil conductor. The first conductor pattern is between the second ends of the RFIC chip and the coil conductor. The first conductor pattern has a fold-back portion where the direction in which the pattern extends is folded back.


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