The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 06, 2025

Filed:

May. 16, 2024
Applicant:

Quanzhou San'an Semiconductor Technology Co., Ltd., Nanan, CN;

Inventors:

Shaohua Huang, Fujian, CN;

Xiaoqiang Zeng, Fujian, CN;

Jianfeng Yang, Fujian, CN;

Canyuan Zhang, Fujian, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2009.12); H01L 25/075 (2005.12); H01L 25/16 (2022.12); H01L 33/64 (2009.12);
U.S. Cl.
CPC ...
H01L 33/62 (2012.12); H01L 25/0753 (2012.12); H01L 25/167 (2012.12); H01L 33/647 (2012.12); H01L 2933/0066 (2012.12); H01L 2933/0075 (2012.12);
Abstract

A light-emitting device includes a lead frame having a first surface on which a patterned conductive layer is provided, and a light-emitting element. The light-emitting element includes an insulating substrate formed on the first surface, a plurality of light-emitting units formed on the insulating substrate, at least one first electrode, at least one second electrode and at least a pair of bonding wires. The first and second electrodes are respectively placed in electrical connection with a first one and a second one of the light-emitting units, and are disposed outward of the light-emitting units. Each of the pair of bonding wires is disposed to electrically connect a respective one of the first and second electrodes to the patterned conductive layer.


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