The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2025
Filed:
Mar. 31, 2016
Applicant:
Creeled, Inc., Durham, NC (US);
Inventors:
Christopher P. Hussell, Cary, NC (US);
Zhenyu Zhong, TKO, HK;
Assignee:
CreeLED, Inc., Durham, NC (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/48 (2009.12); H01L 25/00 (2005.12); H01L 25/075 (2005.12); H01L 27/15 (2005.12); H01L 33/22 (2009.12); H01L 33/52 (2009.12); H01L 33/60 (2009.12); H01L 33/62 (2009.12); H01L 33/56 (2009.12); H01L 33/58 (2009.12);
U.S. Cl.
CPC ...
H01L 33/52 (2012.12); H01L 25/0753 (2012.12); H01L 27/156 (2012.12); H01L 33/22 (2012.12); H01L 33/60 (2012.12); H01L 33/62 (2012.12); H01L 33/56 (2012.12); H01L 33/58 (2012.12); H01L 2224/16225 (2012.12); H01L 2924/181 (2012.12); H01L 2933/005 (2012.12); H01L 2933/0066 (2012.12);
Abstract
Solid state lighting apparatuses, systems, and related methods are provided. An example apparatus can include one or more light emitting diodes (LEDs) and a dark or black encapsulation layer surrounding and/or disposed between the one or more LEDs. The apparatus can include, e.g., a substrate or a leadframe for mounting the LEDs. A method for producing a panel of LEDs can include joining the LEDs to the panel, e.g., by bump bonding, and flooding the panel with dark or black encapsulation material so that the LED chips are surrounded by the dark or black encapsulation material.