The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 06, 2025

Filed:

Aug. 17, 2023
Applicant:

Lawrence Livermore National Security, Llc, Livermore, CA (US);

Inventors:

Maxwell Murialdo, Westminster, CA (US);

Yuliya Kanarska, Livermore, CA (US);

Andrew J. Pascall, Livermore, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2022.12); H01L 25/00 (2005.12); H01L 25/07 (2005.12); H05K 1/16 (2005.12); H05K 3/30 (2005.12);
U.S. Cl.
CPC ...
H01L 25/16 (2012.12); H01L 25/07 (2012.12); H01L 25/50 (2012.12); H05K 1/16 (2012.12); H05K 3/30 (2012.12);
Abstract

The present disclosure relates to a method for forming an electrically conductive ink able to be deposited through a print nozzle during a 3D printing operation. The method may involves providing an electrically non-conductive flowable material adapted to be flowed through a print nozzle during a 3D printing operation. A predetermined quantity of chiplets may then be mixed into flowable material, in accordance with a predefined percolation threshold, to form a percolating chiplet network within the polymer as the ink is flowed through the print nozzle and deposited on a surface. The chiplets each form an engineered electronic component, and ones of the chiplets randomly connect, in accordance with the predefined percolation threshold, to form an electrically conductive circuit having a predetermined circuit characteristic.


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