The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2025
Filed:
Dec. 17, 2020
Dic Corporation, Tokyo, JP;
Ryota Yamaguchi, Sakura, JP;
Makoto Yada, Sakura, JP;
DIC CORPORATION, Tokyo, JP;
Abstract
Provided is a method for manufacturing a conductive pillar capable of bonding a substrate and a bonding member with high bonding strength via a bonding layer without employing an electroplating method, and a method for manufacturing a bonded structure by employing this method. A method for manufacturing a conductive pillarincludes, in sequence, the steps of forming a resist layeron a substrateprovided with an electrode pad, the resist layerincluding an opening portionon the electrode pad, forming a thin Cu filmby sputtering or evaporating Cu on a surface of the substrateprovided with the resist layerincluding the opening portion, filling the opening portionwith a fine particle copper paste, and sintering the fine particle copper pasteby heating the substratefilled with the fine particle copper paste