The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 06, 2025

Filed:

Jun. 14, 2022
Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventors:

Yoshihito Otsubo, Nagaokakyo, JP;

Takafumi Kusuyama, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2005.12); H01L 21/48 (2005.12); H01L 21/56 (2005.12); H01L 23/498 (2005.12); H01L 23/552 (2005.12);
U.S. Cl.
CPC ...
H01L 23/552 (2012.12); H01L 21/4853 (2012.12); H01L 21/4857 (2012.12); H01L 21/565 (2012.12); H01L 23/3121 (2012.12); H01L 23/49822 (2012.12); H01L 23/49838 (2012.12);
Abstract

A module includes a main substrate, a sub-module mounted on a first surface of the main substrate, a first component mounted on the first surface separately from the sub-module, and a first sealing resin formed so as to cover the first surface and the first component. The sub-module includes a second component, a second sealing resin disposed so as to cover the second component, and an inner shield film formed so as to cover at least a part of side surfaces of the second sealing resin and not to electrically connect to the main substrate. A ground connection conductor is disposed so as to electrically connect to the inner shield film, and the ground connection conductor is exposed to the outside.


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