The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2025
Filed:
May. 20, 2021
Applicants:
Chengdu Boe Optoelectronics Technology Co., Ltd., Sichuan, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Inventors:
Assignees:
CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., Sichuan, CN;
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2005.12); H01L 23/00 (2005.12);
U.S. Cl.
CPC ...
H01L 23/49811 (2012.12); H01L 23/49827 (2012.12); H01L 23/49838 (2012.12); H01L 23/4985 (2012.12); H01L 23/49866 (2012.12); H01L 24/16 (2012.12); H01L 24/32 (2012.12); H01L 24/73 (2012.12); H01L 2224/16227 (2012.12); H01L 2224/32225 (2012.12); H01L 2224/73204 (2012.12);
Abstract
The present disclosure relates to a flip-chip and a chip packaging structure. The flip-chip includes: a driver chip having a package surface facing a wiring substrate; and a plurality of conductive connectors. Any one of the plurality of conductive connectors includes a conductive bump connected to the package surface and a conductive extension portion on a side of the conductive bump away from the driver chip.