The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 06, 2025

Filed:

Dec. 10, 2019
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

John Paul Tellkamp, Rockwall, TX (US);

Chang-Yen Ko, Taipei, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2005.12); H01L 23/495 (2005.12);
U.S. Cl.
CPC ...
H01L 23/3114 (2012.12); H01L 23/3107 (2012.12); H01L 23/49503 (2012.12); H01L 23/49551 (2012.12); H01L 23/49555 (2012.12); H01L 23/49575 (2012.12); H01L 2224/05554 (2012.12); H01L 2224/48137 (2012.12); H01L 2224/48247 (2012.12); H01L 2224/49171 (2012.12);
Abstract

A semiconductor isolation package includes a leadframe that includes a plurality of leadframe leads. At least one of the plurality of leadframe leads includes a lead body having a first end that comprises an external pin portion and a second end. The lead body has a leg portion coupled to a central lead portion that is coupled to an edge bend portion. The edge bend portion is formed by a first bend on the lead body proximate the second end between the central lead portion and edge bend portion. The first bend is in the direction of the first end on the leg portion. The edge bend assists in shielding electronic fields. Other aspects are presented.


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