The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2025
Filed:
Aug. 20, 2021
Applicant:
Zeus Co., Ltd., Hwaseong-si, KR;
Inventors:
Woon Kong, Cheonan-si, KR;
Ji Hoon Song, Cheonan-si, KR;
Ung Jo Moon, Osan-si, KR;
Ji Ho Park, Hwaseong-si, KR;
Won Seok Choi, Hwaseong-si, KR;
Assignee:
ZEUS CO., LTD., Hwaseong-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/687 (2005.12); H01L 21/67 (2005.12); H01L 21/683 (2005.12);
U.S. Cl.
CPC ...
H01L 21/68764 (2012.12); H01L 21/67126 (2012.12); H01L 21/6838 (2012.12); H01L 21/68792 (2012.12);
Abstract
A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck, and a chuck module installed in the rotating chuck to fix the ring cover to the rotating chuck.