The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 06, 2025

Filed:

Jun. 23, 2022
Applicants:

Denka Company Limited, Tokyo, JP;

National Institute for Materials Science, Tsukuba, JP;

Inventors:

Hiromitsu Chatani, Tokyo, JP;

Daisuke Ishikawa, Tokyo, JP;

Jie Tang, Ibaraki, JP;

Tadakatsu Ohkubo, Ibaraki, JP;

Shuai Tang, Ibaraki, JP;

Jun Uzuhashi, Ibaraki, JP;

Kazuhiro Hono, Ibaraki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 1/02 (2005.12); H01J 9/02 (2005.12); H01J 37/06 (2005.12);
U.S. Cl.
CPC ...
H01J 1/02 (2012.12); H01J 9/02 (2012.12);
Abstract

A manufacturing method for an electron source according to the present disclosure includes steps of: (A) cutting out a chip from a block of an electron emission material, (B) fixing a first end portion of the chip to a distal end of a support needle, and (C) sharpening a second end portion of the chip. The step (A) includes forming first and second grooves which constitute first and second surfaces of the chip in the block by irradiating a surface of the block with an ion beam. The first end portion of the chip includes the first surface and the second surface with the surfaces forming an angle α of 10 to 90°. The step (B) includes forming a joint between the distal end of the support needle and the first end portion of the chip.


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