Semiconductor package inspection with predictive model for wirebond radio frequency performance

Abstract

Methods, systems and devices for use in semiconductor package manufacture of a package having a die and die substrate are provided. A method for use in semiconductor package manufacture includes steps of forming one or more wirebond interconnections between the die and the die substrate, capturing input data representative of wirebond interconnection features during inspection of the formed wirebond interconnections, and passing the captured input data to a machine learning (ML) engine. The method further includes processing the captured input data with the machine learning engine using a trained model to obtain an output array of data, evaluating the output array of data to determine a predicted radio-frequency (RF) performance rating, and outputting the predicted RF performance rating. Training data set processing may include applying image data and parameters to a multi-layer neural network to obtain a set of candidate ML models, and selecting an optimal ML model.