The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 06, 2025

Filed:

Dec. 23, 2021
Applicant:

Fluke Corporation, Everett, WA (US);

Inventors:

Michael D. Stuart, Issaquah, WA (US);

John C. Bernet, Bremerton, WA (US);

Assignee:

Fluke Corporation, Everett, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01H 9/00 (2005.12); G01B 11/27 (2005.12); G05B 23/00 (2005.12); G06T 7/00 (2016.12); G06T 7/20 (2016.12); G06T 7/246 (2016.12); G06T 7/30 (2016.12); G06T 7/70 (2016.12); H04N 5/00 (2010.12);
U.S. Cl.
CPC ...
G06T 7/0004 (2012.12); G01B 11/272 (2012.12); G01H 9/00 (2012.12); G06T 7/001 (2012.12); G06T 7/20 (2012.12); G06T 7/246 (2016.12); G06T 7/30 (2016.12); G06T 7/70 (2016.12); G06T 2207/10016 (2012.12); G06T 2207/10048 (2012.12); G06T 2207/30164 (2012.12);
Abstract

Systems and methods can be used for analyzing image data to determine an amount of vibration and/or misalignment in an object under analysis. In some instances, as operating equipment heats up during operation, temperature changes of various portions of the operating equipment leads to changes in dimensions of such portions, leading to misalignment. Multiple sets of data representative of the operating equipment in multiple operating conditions can be used to determine an amount of misalignment due to thermal offsets. Hot and cold temperatures of the equipment can be used to calculate thermal growth of various portions of the equipment, which can be used to determine an amount a misalignment due to thermal offsets. Additionally or alternatively, image data representing the equipment can be used to observe changes in alignment between states.


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