The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 06, 2025

Filed:

Nov. 23, 2021
Applicant:

Coretronic Corporation, Hsin-Chu, TW;

Inventors:

Pei-Rong Wu, Hsin-Chu, TW;

Shi-Wen Lin, Hsin-Chu, TW;

Assignee:

Coretronic Corporation, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03B 21/16 (2005.12); G02B 6/42 (2005.12); H05K 7/20 (2005.12);
U.S. Cl.
CPC ...
G03B 21/16 (2012.12); G02B 6/4269 (2012.12); H05K 7/20136 (2012.12); H05K 7/20263 (2012.12); H05K 7/20272 (2012.12); H05K 7/2039 (2012.12);
Abstract

A heat dissipation module, configured for heat dissipation of at least one first heat source and at least one second heat source, and including a first heat sink, a second heat sink, a first pipe, and a second pipe, is provided. The first heat sink and the first heat source are connected to each other through the first pipe to form a first loop, so that a liquid medium flows through the first heat sink for heat exchange and then flows to the first heat source for circulating heat dissipation. The second heat sink and the second heat source are connected to each other through the second pipe to form a second loop, so that the liquid medium flows through the second heat sink for heat exchange and then flows to the second heat source for circulating heat dissipation. A projection device, including the heat dissipation module, is also provided.


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