The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 06, 2025

Filed:

Feb. 13, 2024
Applicant:

Hisense Broadband Multimedia Technologies Co., Ltd., Shandong, CN;

Inventors:

Long Zheng, Shandong, CN;

Sigeng Yang, Shandong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/38 (2005.12); G02B 6/42 (2005.12); G02B 6/43 (2005.12); G02B 6/12 (2005.12);
U.S. Cl.
CPC ...
G02B 6/4281 (2012.12); G02B 6/3885 (2012.12); G02B 6/389 (2012.12); G02B 6/43 (2012.12); G02B 6/1203 (2012.12); G02B 6/387 (2012.12);
Abstract

An optical module including a circuit board, a circuit adapter board disposed on and electrically connected to the circuit board, a silicon optical chip disposed on and electrically connected to the circuit adapter board, an optical fiber socket optically connected to the silicon optical chip through a first optical fiber ribbon, and a light source disposed on and electrically connected to the circuit board and optically connected to the silicon optical chip through a second optical fiber ribbon; wherein a thermal expansion coefficient of the circuit adapter board is lower than that of the circuit board, the silicon optical chip is provided with optical waveguide end facet on a side thereof configured to be butted with the first optical fiber ribbon and the second optical fiber ribbon, and the circuit adapter board has a notch on a side thereof proximate to the optical waveguide end facets.


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