The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 06, 2025

Filed:

Aug. 16, 2021
Applicant:

Raytheon Technologies Corporation, Farmington, CT (US);

Inventors:

Xia Tang, West Hartford, CT (US);

Richard Wesley Jackson, Mystic, CT (US);

James T. Beals, West Hartford, CT (US);

Kenneth David Smith, East Longmeadow, MA (US);

Assignee:

RTX Corporation, Farmington, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 26/00 (2005.12); C04B 35/14 (2005.12); C04B 35/622 (2005.12); C04B 35/626 (2005.12); C04B 35/64 (2005.12); F02C 7/30 (2005.12);
U.S. Cl.
CPC ...
C23C 26/00 (2012.12); C04B 35/14 (2012.12); C04B 35/62222 (2012.12); C04B 35/62655 (2012.12); C04B 35/6269 (2012.12); C04B 35/64 (2012.12); F02C 7/30 (2012.12); C04B 2235/3418 (2012.12); C04B 2235/3891 (2012.12); C04B 2235/9607 (2012.12); C04B 2235/9684 (2012.12); F05D 2230/22 (2012.12); F05D 2230/90 (2012.12); F05D 2240/35 (2012.12); F05D 2300/611 (2012.12);
Abstract

An example article according to the present disclosure includes, among other possible things, a metallic substrate, and a bond coat on the metallic substrate. The bond coat includes a matrix phase, gettering particles in the matrix phase, wherein the gettering particles are reactive with oxidants, and a dispersion of matrix modifier particles in the matrix phase. The example article also includes a diffusion barrier between the bond coat and the metallic substrate, wherein the diffusion barrier is configured to inhibit diffusion of components from the bond coat into the metallic substrate. An example composite material and method of applying a barrier to a substrate are also disclosed.


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