The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2025
Filed:
Jun. 03, 2020
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Hiromichi Akiyama, Tokyo, JP;
Kiyoka Takagi, Tokyo, JP;
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
Abstract
An object is to provide a composite pre-bonding treatment method that stabilizes quality of a bonded part. The present disclosure provides a composite pre-bonding treatment method performed when bonding a composite material to a member. The method includes: (S) attaching an absorber adapted to absorb a contaminant to a surface of a prepreg laminate that is a precursor of the composite material; (S) covering the prepreg laminate with a packaging material from above the absorber; (S) vacuuming the packaging material and heating the prepreg laminate at a temperature lower than a curing temperature of a prepreg; (S) then removing the packaging material; (S) peeling off the absorber; (S) attaching, to a surface of the prepreg laminate with the absorber peeled off, a release member that does not transfer silicone or fluorine to a resin, and then (S) curing the prepreg laminate to mold the composite material; and (S) peeling off the release member from the composite material before bonding the member.