The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2025
Filed:
Sep. 24, 2019
Kobayashi & Co., Ltd., Tokyo, JP;
Keisuke Sakai, Matsudo, JP;
Nanae Tanaka, Matsudo, JP;
Kenji Miyashita, Tokyo, JP;
Go Kobayashi, Tokyo, JP;
KOBAYASHI & CO., LTD., Tokyo, JP;
Abstract
An object of the invention is to provide a method for conditioning a surface of a molded article. The present invention relates to a combination of a mold used for curing a thermosetting resin and a release film placed between the thermosetting resin and the mold during the curing. The release film comprises a base layer formed of a thermoplastic resin and a surface layer formed of a particle-containing fluororesin and laminated to the face which is placed during the curing on the side of the thermosetting resin among the two faces of the base layer. The mold has an irregularity formed on the face brought into contact with the release film during the curing.