The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 06, 2025

Filed:

Nov. 16, 2022
Applicant:

GM Global Technology Operations Llc, Detroit, MI (US);

Inventors:

Steven Cipriano, Chesterfield Township, MI (US);

Pei-chung Wang, Forest Hills, NY (US);

Zhenke Teng, Troy, MI (US);

Anthony V. Minatel, Fenton, MI (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 11/20 (2005.12); B23K 11/11 (2005.12); B23K 35/36 (2005.12); B23K 37/00 (2024.12); B23K 103/04 (2005.12); B23K 103/10 (2005.12);
U.S. Cl.
CPC ...
B23K 11/20 (2012.12); B23K 11/115 (2012.12); B23K 35/3613 (2012.12); B23K 37/00 (2012.12); B23K 2103/04 (2018.07); B23K 2103/10 (2018.07);
Abstract

Methods and systems for joining multiple workpieces are provided. In one example, the method includes dispensing adhesive on a first workpiece. A second workpiece is contacted with the adhesive such that the adhesive is disposed between the first and second workpieces. Resistance heating is produced in the first and second workpieces at first processing conditions to partially cure the adhesive and affix the first and second workpieces together to form a partially cured, adhesive-joined workpiece assembly. The partially cured, adhesive-joined workpiece assembly is exposed to heat at second processing conditions to substantially fully cure the adhesive.


Find Patent Forward Citations

Loading…