The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2025

Filed:

Feb. 25, 2020
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Daniel Leisen, Regensburg, DE;

Simon Jerebic, Donaustauf, DE;

Max Wenzel, Altdorf, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10H 20/853 (2024.12); H10H 20/01 (2024.12); H10H 20/80 (2024.12); H10H 20/854 (2024.12); H10H 20/857 (2024.12);
U.S. Cl.
CPC ...
H10H 20/853 (2024.12); H10H 20/0362 (2024.12); H10H 20/0364 (2024.12); H10H 20/854 (2024.12); H10H 20/857 (2024.12); H10H 20/872 (2024.12);
Abstract

In an embodiment a method for manufacturing at least one electronic component includes providing a second surface area of the component adjacent to a first surface area, wherein the second surface area is repulsive to a first fluid to be applied, applying the first fluid without additional pressurization to the first and/or second surface area, wherein the first surface area is wetted by the first fluid and the first fluid is repelled from the second surface area and applying a second fluid to the first surface area, to the second surface area and/or to a surface area of the solidified first fluid, after solidification of the first fluid applied to the first surface area, wherein applying the second fluid includes applying a positive pressure, a plasma action and/or a compression molding, and wherein the second fluid wets the second surface area.


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