The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2025

Filed:

Apr. 22, 2022
Applicant:

Sandisk Technologies Llc, Addison, TX (US);

Inventors:

Nao Nagase, Yokkaichi, JP;

Chiko Kudo, Yokkaichi, JP;

Tsutomu Imai, Yokkaichi, JP;

Assignee:

Sandisk Technologies, Inc., Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 88/00 (2024.12); H10B 41/27 (2022.12); H10B 43/27 (2022.12);
U.S. Cl.
CPC ...
H10B 43/27 (2023.01); H10B 41/27 (2023.01);
Abstract

A sacrificial memory opening fill structure for a multi-tier memory device may include a semiconductor fill material portion a metallic fill material portion to enhance control of a vertical cross-sectional profile of an inter-tier memory opening. Multiple inter-tier dielectric layers may be employed to reduce sharp corners in a memory opening fill structure. Alternatively or additionally, a combination of an isotropic etch process followed by an anisotropic etch process may be used to form a first-tier memory opening.


Find Patent Forward Citations

Nagase, Nao. (2025). Multi-tier memory device with rounded joint structures and methods of making the same (U.S. Patent No. 12289886). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12289886

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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