The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2025
Filed:
Nov. 11, 2022
Applicants:
Hyundai Motor Company, Seoul, KR;
Kia Corporation, Seoul, KR;
Inventors:
Myung Ill You, Gwangju, KR;
Nam Sik Kong, Hwaseong-si, KR;
Assignees:
HYUNDAI MOTOR COMPANY, Seoul, KR;
KIA CORPORATION, Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/06 (2005.12); H01L 21/52 (2005.12); H01L 23/047 (2005.12); H01L 23/051 (2005.12); H01L 23/373 (2005.12); H01L 23/473 (2005.12); H01L 23/48 (2005.12); H01L 23/492 (2005.12); H01L 23/498 (2005.12); H01L 23/50 (2005.12); H01L 25/07 (2005.12); H01L 25/16 (2022.12); H01L 25/18 (2022.12); H05K 7/20 (2005.12); H02M 1/32 (2006.12);
U.S. Cl.
CPC ...
H05K 7/20945 (2012.12); H05K 7/06 (2012.12); H02M 1/327 (2021.04);
Abstract
A power module comprises a chip, a power lead electrically connected to the chip and at least one substrate, each of at least one substrate including an outer metal layer bonded to an outer side portion of an insulating layer and an inner metal layer bonded to an inner side portion of the insulating layer, respectively, wherein the outer metal layer and the inner metal layer have different perimeters so that the outer metal layer and the inner metal layer have asymmetric structures.