The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2025

Filed:

Apr. 19, 2023
Applicant:

Japan Display Inc., Tokyo, JP;

Inventor:

Takumi Sano, Tokyo, JP;

Assignee:

Japan Display Inc., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 65/00 (2005.12); H05K 1/02 (2005.12); H05K 3/28 (2005.12); H05K 3/46 (2005.12); B29C 65/02 (2005.12); B29C 65/48 (2005.12); B29C 65/50 (2005.12); B29C 65/52 (2005.12); B29C 65/74 (2005.12); B29C 65/78 (2005.12); H05K 3/00 (2005.12);
U.S. Cl.
CPC ...
H05K 3/4682 (2012.12); H05K 1/028 (2012.12); H05K 3/28 (2012.12); B29C 65/02 (2012.12); B29C 65/4815 (2012.12); B29C 65/50 (2012.12); B29C 65/524 (2012.12); B29C 65/7419 (2012.12); B29C 65/745 (2012.12); B29C 65/7891 (2012.12); B29C 65/7894 (2012.12); B29C 66/02241 (2012.12); B29C 66/0242 (2012.12); B29C 66/431 (2012.12); B29C 66/4332 (2012.12); H05K 3/0017 (2012.12);
Abstract

According to one embodiment, a method of manufacturing a flexible substrate, includes forming a release layer on a glass substrate, forming an insulating base, forming a plurality of insulating layers, wiring lines and electrical elements, asking the release layer, the insulating base and the plurality of insulating layers from above to the glass substrate via a mask, forming an upper resin layer, removing the glass substrate and the release layer by peeling off an interface between the release layer and the insulating base and forming a lower resin layer so as to be in contact with a lower surface of the insulating base and a lower surface of the upper resin layer.


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