The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2025
Filed:
Jul. 15, 2021
Gebr. Schmid Gmbh, Freudenstadt, DE;
Christian Buchner, Baiersbronn, DE;
Jürgen Haungs, Freudenstadt, DE;
Christian Schmid, Freudenstadt, DE;
Gebr. Schmid GmbH, Freudenstadt, DE;
Abstract
A method of producing a printed circuit board includes providing a base substrate that is a film or plate, has first and second substrate sides and consists partly of an electrically non-conducting organic polymer material, where the first substrate side is covered with a capping metal layer, and regionally removing the capping metal layer, wherein regionally removing the capping metal layer includes applying a mask layer to the capping metal layer, regionally removing the mask layer by a laser so that the first substrate side is divided into at least one first subregion, in which the first substrate side is covered only with the capping metal layer, and into at least one second subregion, in which the first substrate side is covered with the capping metal layer and by the mask layer, and removing the capping metal layer in the at least one first subregion by an etching solution.