The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2025

Filed:

Jun. 09, 2020
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Syoichi Nishi, Fukuoka, JP;

Hideki Sumi, Fukuoka, JP;

Hiroshi Murata, Saga, JP;

Koji Sakurai, Fukuoka, JP;

Kenichi Ichikawa, Fukuoka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 13/00 (2005.12); H05K 13/08 (2005.12);
U.S. Cl.
CPC ...
H05K 13/089 (2018.07); H05K 13/0812 (2018.07); H05K 13/0815 (2018.07);
Abstract

A method for manufacturing a mounting board includes a first outer shape position acquisition step, a feature portion position acquisition step, a calculation step, a holding step, a second outer shape position acquisition step, and a mounting step. In the first outer shape position acquisition step, a first outer shape position of a component is acquired. In the feature portion position acquisition step, a position of a feature portion is acquired. In the calculation step, a deviation amount of the position of the feature portion with respect to the first outer shape position is calculated. In the second outer shape position acquisition step, a second outer shape position of the component is acquired. In the mounting step, the feature portion of the component is mounted to be positioned on a target position of a board based on the second outer shape position and the deviation amount.


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