The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2025

Filed:

Feb. 01, 2023
Applicant:

Nitto Denko Corporation, Osaka, JP;

Inventors:

Hayato Takakura, Osaka, JP;

Naoki Shibata, Osaka, JP;

Kenya Takimoto, Osaka, JP;

Chihiro Watanabe, Osaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/05 (2005.12);
U.S. Cl.
CPC ...
H05K 1/05 (2012.12); H05K 2201/09036 (2012.12);
Abstract

A wiring circuit board includes a metal supporting layer, an insulating base layer, and a wiring layer. The wiring circuit board further includes a plurality of streak groove portions disposed on one surface of the metal supporting layer in the thickness direction and a plurality of concave portions depressed in the metal supporting layer in the thickness direction. The plurality of concave portions forms a dot pattern. Each of the dots in the dot pattern has one concave surface. The concave surface has an approximately spherical cap shape or an approximately cone shape.


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