Thermal mitigation in user equipment having multiple communication modules

Abstract

In some aspects, the present disclosure provides methods, apparatuses, and systems for efficient thermal mitigation while maintaining wireless device performance on a primary component carrier (PCC). Embodiments described may include implementation of target transceiver module configurations, where bandwidth (e.g., PCC bands and secondary component carrier (SCC) bands) may be monitored by a wireless device based on intra-module target configurations and/or inter-module target configurations. An intra-module target configuration may include a target transceiver module monitoring both PCC bands and SCC bands. An inter-module target configuration may include or refer to a plurality of target transceiver modules together monitoring PCC bands and SCC bands. In scenarios where operating temperatures exceed temperature thresholds, target transceiver module configurations may be implemented to transition PCC bands, SCC bands, or both, from a PCC-resident transceiver module to another transceiver module to reduce the operating temperatures of concern. Various additional and alternative aspects are described herein.