The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2025

Filed:

May. 08, 2019
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Takafumi Tsukagoshi, Hyogo, JP;

Shinya Miyazaki, Hyogo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M 50/449 (2020.12); H01M 10/052 (2009.12); H01M 50/443 (2020.12); H01M 50/463 (2020.12);
U.S. Cl.
CPC ...
H01M 50/449 (2020.12); H01M 10/052 (2012.12); H01M 50/443 (2020.12); H01M 50/463 (2020.12);
Abstract

This separator is provided with a resin substrate, a first heat-resistant layer that covers the entirety of one surface of the resin substrate, a second heat-resistant layer that covers a portion of the other surface of the resin substrate, and an uncovered region that is in the other surface of the resin substrate and that is not covered by the second heat-resistant layer, wherein the first heat-resistant layer and the second heat-resistant layer each include inorganic particles and a binder. In each of the heat-resistant layers, the contained amount of the inorganic particles is 50-90 mass %, the contained amount of the binder is 10-50 mass %, and the uncovered region is connected to the end portion of the resin substrate.


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